Method of manufacturing semiconductor device

ABSTRACT

The method includes the steps of: providing a lead frame, including providing a concaved part in an upper face of a joint part of a die-pad-support lead of a lead frame for setting down a die pad and a tie-bar; bonding a semiconductor chip to a first principal face of the die pad via an adhesive-member layer; then, setting the lead frame between first and second molding dies having first and second cavities respectively so that the first and second cavities are opposed to each other, and the second principal face of the die pad faces toward the second cavity; and forming first and second resin sealed bodies on the sides of the first and second principal faces of the die pad respectively by resin sealing with the first and second molding dies clamping the tie-bar and a part of the lead frame surrounding the tie-bar.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.13/898,834, filed May 21, 2013, which claims priority from Japaneseapplication JP 2012-117490 filed on May 23, 2012, the content of whichis hereby incorporated by reference into this application.

BACKGROUND

The present invention relates to a method of manufacturing asemiconductor device (or a semiconductor integrated circuit device), andparticularly to a technique useful in application to a resin moldingtechnique.

Japanese Unexamined Patent Publication No. JP-A-2010-263066 relates toresin seal techniques such as QFP (Quad Flat Package), and QFN (QuadFlat Non-Leaded Package). Therein disclosed is a technique for providinga recess part in a gate insert piece in order to prevent an inner leadin a corner part from being deformed as a result of the concentration ofa clamp pressure by a gate insert piece (Gate Insert Piece) of a mold.

JP-A-2001-320007, and U.S. Pat. No. 6,744,118 which is a counterpartthereof relate to a single-side collective mold in which a lead frame isused. Therein disclosed is a technique for performing half-etching on atie-bar portion of a boundary portion between unit device regions toavoid various problems involved in package dicing.

SUMMARY

As to a mold process of a lead frame article, taking a transfer mold asan example, a resin is supplied to inside a cavity with a tie-bar (dambar) of a lead frame clamped with a mold. In this step, the width of aclamp part is made larger than that of the tie-bar so that the tie-barcan be clamped with a clamp part of the mold with reliability. As aresult, each of the leads (inner lead and outer lead), and a hanginglead (i.e. die-pad-support lead) is partially clamped with the mold.Then, clamping the hanging lead with the mold, the hanging lead isdeformed by the clamp pressure, and thus the position of a die pad whichthe hanging lead is connected to is shifted upward or downward.

Now, it has been found from the study made by the inventor that theremay be a risk of a package crack being caused if the die pad is shiftedfrom a predetermined position toward the direction in which the die padis offset. Specifically, the following has been clear: in regard to alead frame having a die pad already set down at the time of molding, forexample, if the die pad is shifted to a position below a predeterminedposition, a sealed body which is to be formed on the lower-face side ofthe die pad becomes thinner than a desired thickness and consequently, astress applied to a sealed body formed on the lower-face side of the diepad can cause a package crack. Further, in regard to a lead frame havinga die pad already set up at the time of molding, if the die pad isshifted to a position above a predetermined position, a sealed body tobe formed on the upper-face side of the die pad becomes thinner than adesired thickness and therefore, a stress applied to the sealed bodyformed on the upper-face side of the die pad can cause a package crack.

While the means for solving the problem like this, and others will bedescribed below, other problems and novel features thereof will becomeapparent from the description hereof and the accompanying drawings.

Of the embodiments herein disclosed, a representative embodiment will bebriefly outlined below.

The method of manufacturing a double-side-resin-seal-type semiconductordevice having leads on each side according to one embodiment hereofincludes, in outline, providing a concaved part in upper or lower faceof a joint part of a die-pad-support lead of a lead frame with a die padset down and a tie-bar.

Of embodiments herein disclosed, a representative one brings about theeffect as briefly described below.

According to one embodiment hereof, it is possible to prevent thedeformation of a die-pad-support lead at the time of sealing the resin.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of a lead frame in the course of an assemblyprocess (at the time of completion of a lead frame preparation step) forexplaining the first half of the assembly process (to the wire bonding)in a method of manufacturing a semiconductor device according to oneembodiment hereof;

FIG. 2 is a sectional view showing a cross section of the lead frame ofFIG. 1 taken along the line X-X′;

FIG. 3 is a sectional view showing a cross section of the lead frame ofFIG. 1 taken along the line D-D′;

FIG. 4 is a top view of a lead frame in the course of an assemblyprocess (at the time of completion of a die bonding step) for explainingthe first half of the assembly process (to the wire bonding) in themethod of manufacturing a semiconductor device according to the oneembodiment;

FIG. 5 is a sectional view showing a cross section of the lead frame ofFIG. 4 taken along the line X-X′;

FIG. 6 is a sectional view showing a cross section of the lead frame ofFIG. 4 taken along the line D-D′;

FIG. 7 is a top view of the lead frame in the course of an assemblyprocess (at the time of completion of a wire bonding step) forexplaining the first half of the assembly process (to the wire bonding)in the method of manufacturing a semiconductor device according to oneembodiment hereof;

FIG. 8 is a sectional view showing a cross section of the lead frame ofFIG. 7 taken along the line X-X′;

FIG. 9 is a sectional view showing a cross section of the lead frame ofFIG. 7 taken along the line D-D′;

FIG. 10 is a top view of the lead frame in the course of the assemblyprocess (in a clamping step of the lead frame) for explaining animportant part (sealing process) of the assembly process in the methodof manufacturing a semiconductor device according to one embodimenthereof;

FIG. 11 is an enlarged top view showing a cut-out region R1 of thecorner part of the lead frame of FIG. 10;

FIG. 12 is a schematic sectional view taken along the line M-M′ of FIG.11 (in the clamping step of the lead frame);

FIG. 13 is a schematic sectional view showing a cross section takenalong the line X-X′ of FIG. 10 (in the clamping step of the lead frame);

FIG. 14 is a schematic sectional view showing a cross section takenalong the line D-D′ of FIG. 10 (in the clamping step of the lead frame);

FIG. 15 is a schematic sectional view showing a cross section takenalong the line C-C′ of FIG. 10 (in the clamping step of the lead frame);

FIG. 16 is a schematic sectional view taken along the line M-M′ of FIG.11 (in the resin sealing step);

FIG. 17 is a schematic sectional view showing a cross section takenalong the line X-X′ of FIG. 10 (at the time of completion of the resinsealing step);

FIG. 18 is a drawing for explaining the latter half stage of theassembly process (the process of cutting the tie-bar, etc.) in themethod of manufacturing a semiconductor device according to theembodiment hereof, which presents a schematic cross section of the leadframe (in a upper portion, provided that the interior structure of thesealed body is not shown) and a top view (in a lower portion) (beforethe step of cutting the lead frame corner part);

FIG. 19 is a schematic sectional view of a cross section of the leadframe taken along the line X-X′ of FIG. 18 and a cutting device (theinterior structure of the sealed body is not shown);

FIG. 20 is a top view of the lead frame (in the step of cutting the leadframe corner part) for explaining the latter half stage of the assemblyprocess (the process of cutting the tie-bar, etc.) in the method ofmanufacturing a semiconductor device according to the embodiment hereof;

FIG. 21 is a schematic sectional view of a cross section of the leadframe taken along the line X-X′ of FIG. 20, and the cutting device (theinterior structure of the sealed body is not shown);

FIG. 22 is a top view of the lead frame (in the step of cutting thetie-bar) for explaining the latter half stage of the assembly process(the process of cutting the tie-bar, etc.) in the method ofmanufacturing a semiconductor device according to the embodiment hereof;

FIG. 23 is a schematic sectional view of a cross section of the leadframe taken along the line X-X′ of FIG. 22, and the cutting device (theinterior structure of the sealed body is not shown);

FIG. 24 is a top view of the lead frame (after the step of cutting thetie-bar) for explaining the latter half stage of the assembly process(the process of cutting the tie-bar, etc.) in the method ofmanufacturing a semiconductor device according to the embodiment hereof;

FIG. 25 is a schematic sectional view of a cross section of the leadframe taken along the line X-X′ of FIG. 24, and the cutting device (theinterior structure of the sealed body is not shown);

FIG. 26 is a top view of a separated package (sealed body) forexplaining the assembly process final stage (lead-shaping process) inthe method of manufacturing a semiconductor device according to theembodiment hereof;

FIG. 27 is a bottom view of the separated package (sealed body) forexplaining the assembly process final stage (lead-shaping process) inthe method of manufacturing a semiconductor device according to theembodiment hereof;

FIG. 28 is a sectional view showing a cross section taken along the lineX-X′ of FIG. 26;

FIG. 29 is a sectional view showing a cross section taken along the lineD-D′ of FIG. 26;

FIG. 30 is a top view of the lead frame for explaining a modification(specifically, a non-branch die-pad-support lead) in connection with thetwo-dimensional shape of the lead frame in the method of manufacturing asemiconductor device according to the embodiment hereof;

FIG. 31 is a top view of the lead frame for explaining a modification(specifically, a simple-large-area die pad) in connection with thetwo-dimensional shape of the lead frame in the method of manufacturing asemiconductor device according to the embodiment hereof;

FIG. 32 is a top view of the lead frame for explaining a modification(specifically, an opened large-area die pad) in connection with thetwo-dimensional shape of the lead frame in the method of manufacturing asemiconductor device according to the embodiment hereof;

FIG. 33 is a schematic sectional view (in the step of clamping the leadframe) for explaining a modification in connection with the sealingprocess in the method of manufacturing a semiconductor device accordingto the embodiment hereof, which corresponds to FIG. 12; and

FIG. 34 is a schematic sectional view (in the resin sealing step) takenalong the line M-M′ of FIG. 11 for explaining the outline of the methodof manufacturing a semiconductor device according to the embodimenthereof.

DETAILED DESCRIPTION Summary of the Embodiments

The representative embodiment herein disclosed will be outlined, first.

1. A method of manufacturing a semiconductor device includes the stepsof:

(a) providing a lead frame having

(x1) a substantially rectangular frame-like frame part,

(x2) a substantially rectangular frame-like tie-bar which is supportedby the frame part, and formed therein,

(x3) a plurality of leads extending inward and outward from four sidesof the tie-bar,

(x4) a die pad which is formed inside from the tie-bar, and has firstand second principal faces,

(x5) a die-pad-support lead extending inward from each corner part ofthe tie-bar or a joint part near the corner part, and joined to the diepad,

(x6) a concaved part formed on the side of the first or second principalface of the joint part, and

(x7) a down-set part formed in each die-pad-support lead so as to setdown the die pad on the side of the second principal face;

(b) bonding a semiconductor chip to the first principal face of the diepad via an adhesive-member layer;

(c) after the step (b), setting the lead frame between a first moldingdie having a first cavity and a second molding die having a secondcavity so that the first and second cavities are opposed to each other,and the second principal face of the die pad faces toward the secondcavity; and(d) forming first and second resin sealed bodies on the sides of thefirst and second principal faces of the die pad respectively byexecuting resin sealing with the first and second molding dies clampingthe tie-bar and a part of the lead frame surrounding the tie-bar.

2. In the method of manufacturing a semiconductor device as described inthe item #1, the concaved part is formed on the side of the firstprincipal face of the joint part.

3. In the method of manufacturing a semiconductor device as described inthe item #1 or #2, the adhesive-member layer is a silver paste layer.

4. In the method of manufacturing a semiconductor device as described inany one of the items #1 to #3, the concaved part is formed by etching.

5. In the method of manufacturing a semiconductor device as described inany one of the items #1 to #4, the die pad is included in thesemiconductor chip in plane view.

6. In the method of manufacturing a semiconductor device as described inany one of the items #1 to #5, in the step (d), the first cavity isincluded in the second cavity in plane view.

7. In the method of manufacturing a semiconductor device as described inany one of the items #1 to #6, the first resin-sealed body is thickerthan the second resin-sealed body in thickness in a place where thesemiconductor chip and the die pad are located.

8. In the method of manufacturing a semiconductor device as described inany one of the items #1 to #7, each die-pad-support lead has first andsecond branches on the tie-bar side; the first branch is joined to thetie-bar via a first joint part near one side of corresponding one cornerpart of the tie-bar; and the second branch is joined to the tie-bar viaa second joint part near the other side of the corner part.

9. In the method of manufacturing a semiconductor device as described inthe item #8, the concaved part is formed to extend outward from a branchpart of the first and second branches to a depth of one half of thewidth inside the tie-bar belonging to the joint part along a directionof the width of the tie-bar.

10. In the method of manufacturing a semiconductor device as describedin any one of the items #1 to #7, each die-pad-support lead hassubstantially no branch on its tie-bar side.

11. In the method of manufacturing a semiconductor device as describedin the item #10, of the plurality of leads extending inward and outwardfrom each side of the tie-bar, the leads at least adjacent to eachdie-pad-support lead each have a bent part inward from the tie-bar inthe plane which the lead frame substantially belongs to.

12. In the method of manufacturing a semiconductor device as describedin the item #11, the concaved part is formed to extend outward from anintersection point of a straight line running through the bent part inparallel with one side of the tie-bar closest to the concaved part, andthe die-pad-support lead closest to the concaved part to a depth of onehalf of a width of the tie-bar inside the tie-bar belonging to the jointpart.

13. A method of manufacturing a semiconductor device includes the stepsof:

(a) providing a lead frame having

(x1) a substantially rectangular frame-like frame part,

(x2) a substantially rectangular frame-like tie-bar which is supportedby the frame part, and formed inside therefrom,

(x3) a plurality of leads extending inward and outward from each of foursides of the tie-bar,

(x4) a die pad formed inside from the tie-bar, and having first andsecond principal faces,

(x5) a die-pad-support lead extending inward from each corner part ofthe tie-bar or a joint part near the corner part, and joined to the diepad, and

(x6) a down-set part formed in each die-pad-support lead so as to setdown the die pad on the side of the second principal face;

(b) bonding a semiconductor chip to the first principal face of the diepad via an adhesive-member layer;

(c) after the step (b), setting the lead frame between a first moldingdie having a first cavity and a second molding die having a secondcavity so that the first and second cavities are opposed to each other,and the second principal face of the die pad faces toward the secondcavity; and(d) forming first and second resin sealed bodies on the sides of thefirst and second principal faces of the die pad respectively byexecuting resin sealing with the first and second molding dies clampingthe tie-bar and a part of the lead frame surrounding the tie-bar.

In the method, a clamp-face concaved part is formed in a part of thefirst or second molding die corresponding to the joint part.

14. In the method of manufacturing a semiconductor device as describedin the item #13, the clamp-face concaved part is formed in the firstmolding die.

Next, the outline of other embodiments herein disclosed will bedescribed.

1. A method of manufacturing a semiconductor device includes the stepsof:

(a) providing a lead frame having

(x1) a substantially rectangular frame-like frame part,

(x2) a substantially rectangular frame-like tie-bar which is supportedby the frame part, and formed therein,

(x3) a plurality of leads extending inward and outward from four sidesof the tie-bar,

(x4) a die pad which is formed inside from the tie-bar, and has firstand second principal faces,

(x5) a die-pad-support lead extending inward from each corner part ofthe tie-bar or a joint part near the corner part, and joined to the diepad, and

(x6) a concaved part formed on the side of the first or second principalface of the joint part,

(b) bonding a semiconductor chip to the first principal face of the diepad via an adhesive-member layer;

(c) after the step (b), setting the lead frame between a first moldingdie having a first cavity and a second molding die having a secondcavity so that the first and second cavities are opposed to each other,and the second principal face of the die pad faces toward the secondcavity; and(d) forming first and second resin sealed bodies on the sides of thefirst and second principal faces of the die pad respectively byexecuting resin sealing with the first and second molding dies clampingthe tie-bar and a part of the lead frame surrounding the tie-bar.

2. In the method of manufacturing a semiconductor device as described inthe item #1, the concaved part is formed on the side of the firstprincipal face of the joint part.

3. In the method of manufacturing a semiconductor device as described inthe item #1 or #2, the adhesive-member layer is a silver paste layer.

4. In the method of manufacturing a semiconductor device as described inany one of the items #1 to #3, the concaved part is formed by etching.

5. In the method of manufacturing a semiconductor device as described inany one of the items #1 to #4, the die pad is included in thesemiconductor chip in plane view.

6. In the method of manufacturing a semiconductor device as described inany one of the items #1 to #5, in the step (d), the first cavity isincluded in the second cavity in plane view.

7. In the method of manufacturing a semiconductor device as described inany one of the items #1 to #6, the first resin-sealed body is thickerthan the second resin-sealed body in thickness in a place where thesemiconductor chip and the die pad are located.

8. In the method of manufacturing a semiconductor device as described inany one of the items #1 to #7, each die-pad-support lead has first andsecond branches on the tie-bar side; the first branch is joined to thetie-bar via a first joint part near one side of corresponding one cornerpart of the tie-bar; and the second branch is joined to the tie-bar viaa second joint part near the other side of the corner part.

9. In the method of manufacturing a semiconductor device as described inthe item #8, the concaved part is formed to extend outward from a branchpart of the first and second branches to a depth of one half of thewidth inside the tie-bar belonging to the joint part along a directionof the width of the tie-bar.

10. In the method of manufacturing a semiconductor device as describedin any one of the items #1 to #7, each die-pad-support lead hassubstantially no branch on its tie-bar side.

11. In the method of manufacturing a semiconductor device as describedin the item #10, of the plurality of leads extending inward and outwardfrom each side of the tie-bar, the leads at least adjacent to eachdie-pad-support lead each have a bent part inward from the tie-bar inthe plane which the lead frame substantially belongs to.

12. In the method of manufacturing a semiconductor device as describedin the item #11, the concaved part is formed to extend outward from anintersection point of a straight line running through the bent part inparallel with one side of the tie-bar closest to the concaved part, andthe die-pad-support lead closest to the concaved part to a depth of onehalf of a width of the tie-bar inside the tie-bar belonging to the jointpart.

13. A method of manufacturing a semiconductor device includes the stepsof:

(a) providing a lead frame having

(x1) a substantially rectangular frame-like frame part,

(x2) a substantially rectangular frame-like tie-bar which is supportedby the frame part, and formed inside therefrom,

(x3) a plurality of leads extending inward and outward from each of foursides of the tie-bar,

(x4) a die pad formed inside from the tie-bar, and having first andsecond principal faces, and

(x5) a die-pad-support lead extending inward from each corner part ofthe tie-bar or a joint part near the corner part, and joined to the diepad,

(b) bonding a semiconductor chip to the first principal face of the diepad via an adhesive-member layer;

(c) after the step (b), setting the lead frame between a first moldingdie having a first cavity and a second molding die having a secondcavity so that the first and second cavities are opposed to each other,and the second principal face of the die pad faces toward the secondcavity; and(d) forming first and second resin sealed bodies on the sides of thefirst and second principal faces of the die pad respectively byexecuting resin sealing with the first and second molding dies clampingthe tie-bar and a part of the lead frame surrounding the tie-bar.

In the method, a clamp-face concaved part is formed in a part of thefirst or second molding die corresponding to the joint part.

14. In the method of manufacturing a semiconductor device as describedin the item #13, the clamp-face concaved part is formed in the firstmolding die.

[The Descriptions of the Describing Form Herein, Basic Terms and theUsage Thereof]

1. The description of each embodiment can be presented in two or moresections for the sake of convenience as required. However, the sectionsare not independent of each other, and describe the individual parts ofone embodiment, or one of them describes the detail of the other, orpart or all of the modification thereof except when clearly noted to thecontrary. Further, as a rule, the iteration of the description aboutlike parts shall be skipped. In addition, the respective constituents ofthe embodiment are not essential except when clearly noted to thecontrary, when limited to that number theoretically, and when clearlyspecified to the contrary from the context.

Further, the term “semiconductor device” used herein primarily refers toa semiconductor chip or the like (e.g. a monocrystalline siliconsubstrate), into which various types of transistors (active elements),and resistances, capacitances and other elements arranged around thetransistors are integrated. Representative examples of the various typesof transistors include MISFET (Metal Insulator Semiconductor FieldEffect Transistor) which is typified by MOSFET (Metal OxideSemiconductor Field Effect Transistor). Representative examples of theintegrated circuit structure in this case include CMIS (ComplementaryMetal Insulator Semiconductor) type integrated circuit which is typifiedby CMOS (Complementary Metal Oxide Semiconductor) type integratedcircuit formed by a combination of an N-channel type MISFET and aP-channel type MISFET.

The wafer process of today's semiconductor device, i.e. LSI (Large ScaleIntegration) may be typically classified in two. The first is FEOL(Front End of Line) process from the loading of a silicon wafer as a rawmaterial to the Premetal process (including the step of forming aninterlayer dielectric film or the like between a M1 wiring layer's lowerend and a gate electrode structure, the step of forming a contact hole,and the step of embedding a tungsten plug) or thereabout. The second isBEOL (Back End of Line) process from the step of forming the M1 wiringlayer to the step of forming a pad opening in a final passivation filmlying on an aluminum-based pad electrode or thereabout (in the case of awafer-level package process, including the process).

Now, it is noted that “semiconductor device” includes a discreteelectronic device like a power transistor.

2. Likewise, in the descriptions of the embodiments and others, even inthe case of using the expression “X comprising A” in regard to amaterial, a composition or the like, the idea that an element other thanA is one of primary constituents is not excluded except when clearlynoted to the contrary and when clearly specified to the contrary fromthe context. For instance, in terms of a component, it represents “Xincluding A as a primary component” or the like. Even in the case ofusing the term “silicon member”, for instance, it is not limited to apure silicon. It is obvious that the “silicon member” includes membersof SiGe alloy and other multi-element alloys including silicon as aprimary component, and other members including an additive and the like.

3. Likewise, when showing preferred embodiments for the graphic form,the position, the attribute, etc., it is obvious that the invention isnot strictly limited to the embodiments except when clearly noted to thecontrary, and when clearly specified to the contrary from the context.

4. Also, even if citing a certain numerical value and a certainquantity, the value or quantity concerned may be a value above or belowthe certain numerical value except when clearly noted to the contrary,when limited to that number theoretically, and when clearly specified tothe contrary from the context.

5. Further, in the case of using the term “wafer”, it usually refers toa monocrystalline silicon wafer to form a semiconductor device (whichmay be a semiconductor integrated circuit device, or an electronicdevice) thereon. However, it is obvious that the “wafer” includes acomplex wafer of an insulative substrate, such as an epitaxial wafer, anSOI substrate or an LCD glass substrate, and a semiconductor layer orthe like.

6. A tie-bar of a lead frame herein described has a substantiallyrectangular frame-like shape corresponding to the two-dimensional shapeof a sealed body of a QFP-based package, which may have a chippedportion. The tie-bar is supported by a frame part through anexclusive-use support lead, an extension of a die-pad-support lead, anoutside lead of a typical lead or the like.

The respective portions of the tie-bar corresponding to the four sidesof the sealed body shall be hereinafter referred to as “tie-bar's foursides”. In addition, the region (rectangular region) enclosed by thesubstantially rectangular tie-bar shall be referred to as “tie-barinterior”, and the outside of the tie-bar which is located out of therectangular region shall be referred to as “tie-bar exterior”.

Further Detailed Description of the Embodiments

The embodiment will be described further in detail. In the drawings, thesame or like parts are identified by the same or similar symbols,reference numerals, and the iteration of the description thereof shallbe avoided as a rule.

Further, in the accompanying drawings, a processing such as hatching oneven a cross section can be omitted in the case where such processingwould make the drawing more complex, or the case where cleardiscrimination from a gap can be made. In this connection, a backgroundborder line can be omitted for even a hole which is closed in twodimensions if it is clear from the description thereof, or the like.Further, the hatching can be performed on a portion concerned to clearlyshow that it is not a gap even if the portion is not a cross section.

In regard to the way of alternatively terming two members or parts, inthe case of referring to one member or part with the word “first”prefixed to the name thereof, and the other with the word “second”prefixed to the name thereof, the words “first” and “second” areassociated with the members or parts according to the representativeembodiment, and exemplified in some cases; it is obvious that even themember or part with “first” prefixed to the name thereof, for example,is not limited as exemplified.

1. Description of the First Half Stage (to the Wire Bonding) of anAssembly Process in a Method of Manufacturing a Semiconductor DeviceAccording to One Embodiment Hereof (See Primarily FIGS. 1 to 9)

The embodiments will be concretely described below while chiefly taking,as an example, a QFP (Quad Flat Package) type device, specifically anLQFP (Low Profile Quad Flat Package) type device or a TQFP (Thin QuadFlat Package) type device. It is obvious that these embodiments areapplicable to other double-side-seal type devices with a lead frame usedtherein and the like.

Further, as to the embodiment below, an example such that a concavedpart is formed on the upper side of the lead frame will be describedchiefly and concretely. However, it is obvious that the concaved partmay be formed on the lower side of the lead frame.

While in regard to the embodiment below, a sealing method with achip-mount side facing upward will be chiefly described for convenienceof description, it is obvious that the sealing may be made with thechip-mount side facing downward.

As to the embodiment below, to avoid the complicated description, anexample such that one chip is mounted on one die pad of a lead framewill be described concretely. However, it is obvious that more than onechip may be stacked on or arranged in a lateral direction of the one diepad.

For this embodiment, likewise to avoid the complicated description, adiscrete unit device region of the lead frame will be describedconcretely. However, it is obvious that the lead frame may be composedof a plurality of unit device regions arrayed in a matrix.

Further, in the embodiment below, silver paste is described as diebonding means specifically. However, it is obvious that another kind ofpaste or DAF (Die Attach Film) may be used as the means.

Incidentally, in the embodiment below, for convenience of diagrammaticrepresentation, the number of leads shown diagrammatically is about 30.However, the number of leads in an actual device is e.g. about 200 to600 mostly.

FIG. 1 is a top view of a lead frame in the course of an assemblyprocess (at the time of completion of a lead frame preparation step) forexplaining the first half of the assembly process (to the wire bonding)in a method of manufacturing a semiconductor device according to oneembodiment hereof. FIG. 2 is a sectional view showing a cross section ofthe lead frame of FIG. 1 taken along the line X-X′. FIG. 3 is asectional view showing a cross section of the lead frame of FIG. 1 takenalong the line D-D′. FIG. 4 is a top view of a lead frame in the courseof the assembly process (at the time of completion of a die bondingstep) for explaining the first half of the assembly process (to the wirebonding) in the method of manufacturing a semiconductor device accordingto one embodiment hereof. FIG. 5 is a sectional view showing a crosssection of the lead frame of FIG. 4 taken along the line X-X′. FIG. 6 isa sectional view showing a cross section of the lead frame of FIG. 4taken along the line D-D′. FIG. 7 is a top view of the lead frame in thecourse of the assembly process (at the time of completion of a wirebonding step) for explaining the first half of the assembly process (tothe wire bonding) in the method of manufacturing a semiconductor deviceaccording to one embodiment hereof. FIG. 8 is a sectional view showing across section of the lead frame of FIG. 7 taken along the line X-X′.FIG. 9 is a sectional view showing a cross section of the lead frame ofFIG. 7 taken along the line D-D′. The first half of the assembly process(to the wire bonding) in the method of manufacturing a semiconductordevice according to one embodiment hereof will be described withreference to the drawings.

First, the lead frame 1 (or its unit device region) used for assemblywill be described with reference to FIG. 1. As shown in FIG. 1, theperipheral portion of the lead frame 1 makes a substantially rectangularframe-like (e.g. substantially square) frame part 3. A substantiallyrectangular frame-like tie-bar 4 is formed inside from the frame part.In a center part located substantially at the center when viewed fromthe positions of the frame part 3 and the tie-bar 4, a die pad 6 isformed, which is a so-called “small-area die pad”, and stays in alocational relation such that with a semiconductor chip 2 mounted on afirst principal face 6 a of the die pad 6, the die pad 6 is involved inthe semiconductor chip 2 in plane view.

The die pad 6 is joined to the frame part 3 and the tie-bar 4 (cornerparts 4 c of the tie-bar) through e.g. four die-pad-support leads 7 andsupported thereby. In this embodiment, each die-pad-support lead 7 hasan outer end portion which branches, in a branch part 12, into a firstbranch 7 a and a second branch 7 b, which are referred to as “branch”collectively.

Each die-pad-support lead 7 has a down-set part 11 formed inside fromthe branch part 12. In a joint part 10 of the branches 7 a and 7 bjoined with the tie-bar 4, a concaved part 8 is formed by e.g. etchingon the side of the first principal face 6 a of the die pad 6 (on theside of the first principal face 1 a of the lead frame), namely on theside of the first principal face 1 a of the die-pad-support lead 7.While the concaved part 8 is formed by etching after the patterning ofthe lead frame in this embodiment, the timing of the etching maycoincide with or precede the timing of the patterning of the lead frame.The method of forming the concaved part 8 may be mechanical means inaddition to etching. However, the etching is more advantageous in thatother portions of the die-pad-support lead 7 are not subjected todeformation or the like, and a high machining precision can be achieved.

To each of the four side 4 s of the tie-bar 4, a plurality of leads 5are joined. Each lead has an outer lead part 5 p which extends outwardlyand is joined to and supported by e.g. the frame part 3, and an innerlead part 5 i which extends inwardly. Here, one plane which is inparallel with the principal face of the lead frame, and close to theprincipal face of the die pad and the principal face of the lead frameother than the die pad can be defined as “a plane which the lead framesubstantially belongs to”. In this embodiment, some of the inner leadparts 5 i each have a bend part 5 b which is bent in the plane which thelead frame substantially belongs to. In addition, the intersection point15 of a straight line 14 which runs through the bent part 5 b of theinner lead part 5 i adjacent to the die-pad-support lead 7 in parallelwith the side 4 s of the tie-bar 4 which the lead belongs to, and thedie-pad-support lead 7 (exactly, the intersection point of the straightline 14 and the center line of the die-pad-support lead 7) can bedefined. Now, turning to the two-dimensional locational relation betweenthe intersection point 15 and the concaved part 8 on the branch adjacentto the inner lead part 5 i, the concaved part 8 is formed outward fromthe intersection point 15 in this embodiment.

Now, examples of primary dimensions of the lead frame 1 according tothis embodiment will be noted. The following are preferred: thethickness of the lead frame is e.g. about 125 micrometers; the diameterof the die pad is e.g. about 3 millimeters; the pitch of the outer leadis e.g. about 400 micrometers; the width of the tie-bar is e.g. about150 micrometers; and the quantity of the down setting is e.g. about 240micrometers. The preferred examples of the depth, length and width ofthe concaved part 8 are about 20 to about 30 micrometers, about 300micrometers, and about 150 micrometers, respectively. Herein, thebranches 7 a and 7 b of the die-pad-support lead 7 have a width of e.g.about 150 micrometers. As the material of the lead frame, a copper-basedalloy which includes copper as a primary component is used usually.Specific examples of the copper-based alloy include a Cu—Fe-based alloy,a Cu—Cr—Sn—Zn-based alloy, and a Cu—Zr-based alloy.

Next, a cross section of the lead frame of FIG. 1 taken along the lineX-X′ is shown in FIG. 2. As shown in the drawing, the upper face 6 a(i.e. the chip-mount side, which is located opposite to the secondprincipal face 6 b) of the die pad 6 is arranged by the down setting tobe somewhat lower in height than another part of the lead frame 1 (e.g.the upper face 1 a of the tie-bar 4).

Next, a cross section of the lead frame of FIG. 1 taken along the lineD-D′ is shown in FIG. 3. As shown in the drawing, the upper face(chip-mount side) 6 a of the die pad 6 is arranged by the down settingto be somewhat lower in height than another part of the lead frame 1(e.g. the upper face 1 a of the die-pad-support lead 7 located outwardfrom the down-set part 11) as in the above-described case.

Next, the die bonding is performed on the upper face 6 a of the die pad6 via an adhesive-member layer 9 of e.g. silver paste so that the upperface 2 a of a semiconductor chip 2 (a face opposite to the rear face 2b), namely a face where the chip has a plurality of bonding pads 16formed is arranged upward as shown in FIGS. 4, 5 and 6.

Next, bonding wires 17, e.g. gold wires are used to connect between thebonding pads 16 and inner ends of corresponding leads 5, i.e. inner endsof the inner lead parts 5 i, as shown in FIGS. 7, 8 and 9.

Then, a mold process will be executed.

2. Description of an Important Part (Sealing Process) of the AssemblyProcess in the Method of Manufacturing a Semiconductor Device Accordingto One Embodiment Hereof (See FIGS. 10 to 17, Chiefly.)

The sealing method to be described in this section is premised on thetransfer mold. However, it is obvious that the sealing method may bebased on another resin sealing method such as compression mold.

FIG. 10 is a top view of the lead frame in the course of an assemblyprocess (in the clamping step of the lead frame) for explaining animportant part (sealing process) of the assembly process in the methodof manufacturing a semiconductor device according to one embodimenthereof. FIG. 11 is an enlarged top view showing a cut-out region R1 ofthe corner part of the lead frame of FIG. 10. FIG. 12 is a schematicsectional view taken along the line M-M′ of FIG. 11 (in the clampingstep of the lead frame). FIG. 13 is a schematic sectional view showing across section taken along the line X-X′ of FIG. 10 (in the clamping stepof the lead frame). FIG. 14 is a schematic sectional view showing across section taken along the line D-D′ of FIG. 10 (in the clamping stepof the lead frame). FIG. 15 is a schematic sectional view showing across section taken along the line C-C′ of FIG. 10 (in the clamping stepof the lead frame). FIG. 16 is a schematic sectional view taken alongthe line M-M′ of FIG. 11 (in the resin sealing step). FIG. 17 is aschematic sectional view showing a cross section taken along the lineX-X′ of FIG. 10 (at the time of completion of the resin sealing step).With reference to these drawings, an important part (sealing process) ofthe assembly process in the method of manufacturing a semiconductordevice according to the embodiment hereof will be described.

As shown in FIG. 7, the lead frame 1 after the completion of the wirebonding is set between and clamped by molding dies (consisting of anupper die and a lower die). FIG. 10 presents a plane view when viewing,from above the upper die, the upper face of the lead frame 1 heldclamped in the perspective manner. As shown in FIG. 10, almost all theregions of the tie-bar 4 are clamped by the clamp face 53 a of the upperdie (first molding die) and the clamp face 53 b of the lower die (secondmolding die). Describing the locational relation of the upper and lowerdies in a widthwise direction of the tie-bar 4, the clamp face 53 b ofthe lower die is substantially included in a range that the clamp face53 a of the upper die occupies in plane view. Further, describing thelocational relation of the upper and lower dies in connection with theupper cavity 52 a (first cavity) and the lower cavity 52 b (secondcavity), the upper cavity 52 a is substantially included in a range thatthe lower cavity 52 b occupies in plane view. In other words, it iscited as an example that the outer edge of the upper cavity 52 a islocated inside the outer edge of the lower cavity 52 b by e.g. about 25micrometers over the entire periphery thereof. In such arrangement, oneof upper and lower dies is made larger than the other to provide aclearance so that no trouble is caused even if the upper or lower die isput out of position horizontally.

Incidentally, if such displacement results in no trouble, it is notnecessary to make such arrangement. That is, both the upper and lowerdies may be identical in size with each other. In addition, any of theupper and lower dies may be increased in size.

In a portion in each clamp face 53 a, 53 b corresponding to each cornerpart, e.g. one gate part 54 and three air vent parts 55 are formed.

Now, FIG. 11 presents an enlarged view of a cut-out region R1 of thecorner part of the lead frame of FIG. 10. As shown in the drawing, inthis embodiment, the concaved part 8 formed in each joint part 10 ofeach corner part 4 c of the tie-bar 4, i.e. each joint part 10 of (thebranches 7 a and 7 b of) the die-pad-support lead 7 with the tie-bar 4is arranged as described below. Each concaved part 8 is formed to extendoutward from the branch part 12 of the first and second branches 7 a and7 b to a depth of one half of the width inside the tie-bar 4 belongingto the joint part 10 along a direction of the width of the tie-bar. Thepreferred range of the concaved part 8 where the concaved part extendsranges e.g. from a location in the vicinity of the inner end of theclamp face 53 a of the upper die and inside from the inner end to thewidthwise center of the part of the tie-bar 4 (i.e. on the inside of thecenter line 21 of the tie-bar 4) generally.

Next, a cross section of the part of the lead frame of FIG. 11 takenalong the line M-M′ is shown in FIG. 12. As shown in the drawing, thetie-bar 4 and the die-pad-support lead 7 are clamped by the upper andlower dies 51 a and 51 b (which are referred to as “die 51”collectively) put in contact with the upper and lower faces 1 a and 1 bof the lead 7 close to the tie-bar. In this embodiment, in a certainpart of the concaved part 8, the upper die 51 a is out of contact withthe upper face 1 a of the lead frame 1, and therefore the clamp pressureis not concentrated on this part. A preferred example of a quantity ofoverdrive, namely a quantity by which the die crushes the lead frame inthe clamping is about 10 micrometers. Specifically, it means that thethickness of the lead frame initially having a thickness of e.g. about125 micrometers is made about 115 micrometers in the area where the leadframe is clamped. Now, it is noted that typically during a period oftime when the mold process is executed (from the time of setting thelead frame to the removal thereof), the parts, such as the upper andlower dies, which are brought into contact with the lead frame and thesealing resin are heated and kept at about 175 degrees centigrade.

Subsequently, what was described above is described with reference tothe whole cross section of the die of FIGS. 13, 14 and 15. FIG. 13 showsa cross section taken along the line X-X′ of FIG. 10. As shown in FIG.13, the upper face 1 a of the lead frame 1 is in contact with the clampface 53 a of the upper die over the entire width of the clamp face 53 a,and the lower face 1 b of the lead frame 1 is in contact with the clampface 53 b of the lower die over the entire width of the clamp face 53 b.

FIG. 14 shows a cross section taken along the line D-D′ of FIG. 10. Asshown in FIG. 14, the lower face 1 b of the lead frame 1 is in contactwith the clamp face 53 b of the lower die over the entire width of theclamp face 53 b as in FIG. 12, and the upper face 1 a of the lead frame1 is in contact with the clamp face 53 a of the upper die over theentire width of the clamp face 53 a except apart corresponding to wherethe concaved part 8 is formed. In the part where the concaved part 8 isformed, the clamp face 53 a of the upper die is out of contact with theupper face 1 a of the lead frame 1.

FIG. 15 shows a cross section taken along the line C-C′ of FIG. 10. Asshown in FIG. 15, on the right side of the upper and lower dies 51 a and51 b as in FIG. 14, the lower face 1 b of the lead frame 1 is in contactwith the clamp face 53 b of the lower die over the entire width of theclamp face, and the upper face 1 a of the lead frame 1 is in contactwith the clamp face 53 a of the upper die over the entire width of theclamp face 53 a except apart corresponding to where the concaved part 8is formed. In the part where the concaved part 8 is formed, the clampface 53 a of the upper die is out of contact with the upper face 1 a ofthe lead frame 1. In contrast, on the left side of the upper and lowerdies 51 a and 51 b, the gate part 54 is formed and as such, the leadframe 1 is not clamped for any face thereof in this part.

Next, the sealing resin is charged through the gate part 54 (FIG. 15)into the cavity 52 (FIG. 12) e.g. by the transfer mold, whereby aresin-sealed body 18 including an upper resin-sealed body 18 a(firstresin-sealed body), and a lower resin-sealed body 18 b(secondresin-sealed body) is formed, as shown in FIG. 16.

Taking out the resin-sealed body 18 from the die 51, a lead frame 1sealed by the resin can be obtained. Subsequently, a batch bakingtreatment for cure baking (complete cure) or the like is executed (e.g.at 175 degrees centigrade for several hours approximately).

After that, the process of cutting the tie-bar, etc. is executed.

3. Description of the Latter Half Stage of the Assembly Process in theMethod of Manufacturing a Semiconductor Device According to theEmbodiment Hereof (the Process of Cutting the Tie-Bar, Etc.) (See FIGS.18 to 25, Chiefly.)

In the process described in this section, an unimportant part, namelyeach corner part of a unit device region of the lead frame (i.e. “eachcorner part of the lead frame”) is cut before the tie-bar is cut offbetween the leads, for example. It is obvious that the order of thesteps is arbitrary, and the step of cutting the tie-bar may be performedprecedently.

FIG. 18 is a drawing for explaining the latter half stage of theassembly process (the process of cutting the tie-bar, etc.) in themethod of manufacturing a semiconductor device according to theembodiment hereof, which presents a schematic cross section of the leadframe (in a upper portion, provided that the interior structure of thesealed body is not shown) and a top view (in a lower portion) (beforethe step of cutting the lead frame corner part). FIG. 19 is a schematicsectional view of a cross section of the lead frame taken along the lineX-X′ of FIG. 18 and a cutting device (the interior structure of thesealed body is not shown). FIG. 20 is a top view of the lead frame (inthe step of cutting the lead frame corner part) for explaining thelatter half stage of the assembly process (the process of cutting thetie-bar, etc.) in the method of manufacturing a semiconductor deviceaccording to the embodiment hereof. FIG. 21 is a schematic sectionalview of a cross section of the lead frame taken along the line X-X′ ofFIG. 20, and the cutting device (the interior structure of the sealedbody is not shown). FIG. 22 is a top view of the lead frame (in the stepof cutting the tie-bar) for explaining the latter half stage of theassembly process (the process of cutting the tie-bar, etc.) in themethod of manufacturing a semiconductor device according to theembodiment hereof. FIG. 23 is a schematic sectional view of a crosssection of the lead frame taken along the line X-X′ of FIG. 22, and thecutting device (the interior structure of the sealed body is not shown).FIG. 24 is a top view of the lead frame (after the step of cutting thetie-bar) for explaining the latter half stage of the assembly process(the process of cutting the tie-bar, etc.) in the method ofmanufacturing a semiconductor device according to the embodiment hereof.FIG. 25 is a schematic sectional view of a cross section of the leadframe taken along the line X-X′ of FIG. 24, and the cutting device (theinterior structure of the sealed body is not shown). The latter halfstage of the assembly process (the process of cutting the tie-bar, etc.)in the method of manufacturing a semiconductor device according to theembodiment hereof will be described with reference to the drawings.

FIG. 18 shows the lead frame 1 after the completion of the resin seal.(The lower portion of the drawing presents a top view, and the upperportion presents a simplified cross section taken along the line X-X′).As shown in FIG. 18, the lead frame 1 includes a lead frame main body,and a resin-sealed body 18 formed in the tie-bar 4. In this embodiment,the upper resin-sealed body 18 a (i.e. the first resin-sealed body) issmaller than the lower resin-sealed body 18 b (i.e. the secondresin-sealed body) according to the difference in size between the uppercavity 52 a and the lower cavity 52 b.

The concrete examples of the size are as follows. Assuming the leadframe 1 having a thickness Tf of e.g. about 125 micrometers, the widthTt of the tie-bar is e.g. about 150 micrometers, and the space Tdbetween the sealed body and the tie-bar is e.g. about 150 micrometers.

In such condition, the lead frame 1 is put on a package susceptor 62, asshown in FIG. 19. The cutting device having a corner-part-cutting die 60c attached to its cutting-die-holding part 61 is used to cut each leadframe corner part. FIG. 20 is synthesized by superposing thetwo-dimensional shape presented by the plane view of thecorner-part-cutting die 60 c at this time on the plane view of the leadframe. Then, the cutting is carried out as shown in FIG. 21. The reasonfor performing the cutting from the narrower side toward the wider sidein terms of the width of the sealed body in this way is to prevent thecollision of the cutting die against the side face of the sealed bodywhich causes the deviation of the cutting die. To facilitate doing so,the upper and lower cavities are usually arranged to be different insize as described above. However, if there is no such risk, it isobvious that it is possible to cut the frame in the reverse direction.What was described above applies to the step of cutting the tie-bar aswell as the step of cutting the corner part.

Next, the tie-bar is cut by use of the cutting device having the tie-barcutting die 60 t attached to the cutting-die-holding part 61 as shown inFIGS. 22 and 23, and thus the assembly as shown in FIG. 24 is obtained.Then, the cutting device with the tie-bar cutting die 60 t attached tothe cutting-die-holding part 61 is moved back upward, for example.

After that, the lead shaping process or the like is executed ifrequired.

4. Description of the Assembly Process Final Stage (Lead-ShapingProcess) in the Method of Manufacturing a Semiconductor Device Accordingto the Embodiment Hereof (See FIGS. 26 to 29, Chiefly.)

The lead-shaping method described in this section is just an example,and the lead can take an appropriate shape finally. The lead shaping maybe executed on an as-needed basis, and if not required, the step may beskipped.

FIG. 26 is a top view of a separated package (sealed body) forexplaining the assembly process final stage (lead-shaping process) inthe method of manufacturing a semiconductor device according to theembodiment hereof. FIG. 27 is a bottom view of the separated package(sealed body) for explaining the assembly process final stage(lead-shaping process) in the method of manufacturing a semiconductordevice according to the embodiment hereof. FIG. 28 is a sectional viewshowing a cross section taken along the line X-X′ of FIG. 26. FIG. 29 isa sectional view showing a cross section taken along the line D-D′ ofFIG. 26. The assembly process final stage (lead-shaping process) in themethod of manufacturing a semiconductor device according to theembodiment hereof will be described with reference to the drawings.

The lead frame 1 (FIG. 24) after the completion of the tie-bar cuttingis cut off from the frame part 3 into a package (which is a collectionof a resin-sealed body 18, leads 5, etc.) on an as-needed basis. Then,the lead shaping is executed as required. Now, it is noted that the leadshaping and the cutting from the frame may be performed in any order. Inaddition, the treatment of lead plating is performed before or afterthese steps on an as-needed basis. FIG. 26 presents a top view of apackage which has gone through the lead shaping. As shown in FIG. 26,the upper face 19 a of the resin-sealed body 18 can be seen in thecenter part. Further, a number of leads 5 protrude from each sidethereof, and each lead 5 is bent at its lead-bent part 20.

FIG. 27 presents a bottom view of the package subjected to the leadshaping. As shown in FIG. 27, the lower face 19 b of the resin-sealedbody 18 can be seen in the center part as in the case of FIG. 26.Further, a number of leads 5 protrude from each side hereof, and eachlead 5 is bent at its lead-bent part 20.

FIG. 28 shows a cross section taken along the line X-X′ of FIG. 26. Asshown in FIG. 28, the inner end of each lead 5, a semiconductor chip 2,bonding pads 16, bonding wires 17, a die pad 6, etc. are housed in theresin-sealed body 18. The examples of main sizes in connection with theresin-sealed body 18 are shown here. The thickness of the sealed body ise.g. about 1.4 millimeters in the case of LQFP, whereas in the case ofTQFP, it is e.g. about 1.1 millimeters. The chip thickness (in the caseof the multilayered chip, the total thickness thereof) is e.g. about 280micrometers, the silver paste thickness is e.g. about 10 micrometers. Inaddition, the length of each side of the sealed body (in the case of thesealed body of a substantially square form) is e.g. about 18 millimeters(the main range thereof is from 10 to 28 millimeters approximately).

FIG. 29 shows a cross section taken along the line D-D′ of FIG. 26. Asshown in FIG. 29, almost all parts of the die-pad-support lead 7 exceptits side faces at two opposing ends, the semiconductor chip 2, the diepad 6, and others are housed in the resin-sealed body 18. Further, inthis embodiment, the thickness Ta of the first resin-sealed body 18 a inthe place where the semiconductor chip 2 and the die pad 6 are locatedis thicker than the thickness Tb of the second resin-sealed body 18 b.The reason for this is to secure the loop height of the bonding wire.

Showing concrete examples of the sizes, the thickness Ta of theresin-sealed body 18 a is e.g. about 590 micrometers, and the thicknessTb of the second resin-sealed body 18 b is e.g. about 400 micrometers.

5. Description of Various Modifications in the Two-Dimensional Shape ofthe Lead Frame in the Method of Manufacturing a Semiconductor DeviceAccording to the Embodiment Hereof (See FIGS. 30 to 32, Chiefly.)

In the descriptions above, a small-area die pad (see FIG. 1, forinstance) is taken as an example of the die pad chiefly, which has beendescribed concretely. The embodiments are not limited to such small-areadie pad as described below. The invention is applicable to processes inwhich lead frames having die pads of various areas or shapes are used.It is exactly the same as to the shape of the die-pad-support lead 7.

FIG. 30 is a top view of the lead frame for explaining a modification(specifically, a non-branch die-pad-support lead) in connection with thetwo-dimensional shape of the lead frame in the method of manufacturing asemiconductor device according to the embodiment hereof. FIG. 31 is atop view of the lead frame for explaining a modification (specifically,a simple-large-area die pad) in connection with the two-dimensionalshape of the lead frame in the method of manufacturing a semiconductordevice according to the embodiment hereof. FIG. 32 is a top view of thelead frame for explaining a modification (specifically, an openedlarge-area die pad) in connection with the two-dimensional shape of thelead frame in the method of manufacturing a semiconductor deviceaccording to the embodiment hereof. The various modifications inconnection with the two-dimensional shape of the lead frame in themethod of manufacturing a semiconductor device according to theembodiment hereof will be described with reference to these drawings.

(1) Non-Branch Die-Pad-Support Lead (See FIG. 30, Chiefly.):

The two-dimensional shape of the die-pad-support lead 7 shown in FIG. 30is characterized in that the die-pad-support lead 7 does not branch onthe side closer to the die bar 4 unlike the embodiments including thatof FIG. 1. In this case, the die-pad-support lead 7 has no branch and assuch, an inner-side range of a preferred position to form the concavedpart 8 is the intersection point 15 of: a straight line 14 extendingthrough the bent part 5 b of the lead 5 (the inner lead part 5 i)adjacent to the die-pad-support lead 7 in parallel with the side 4 s ofthe tie-bar 4 crossing the lead 5; and the die-pad-support lead 7 (moreexactly, the center line 22 of the die-pad-support lead 7).

This arrangement is simple in structure, has substantially fourfoldrotation symmetry, and is superior in the stability in holding the diepad. In contrast, the die-pad-support lead 7 with a branch has theeffect of relaxing upward and downward shifts of the die pad owing to aclamp pressure as described below.

(2) Simple-Large-Area Die Pad (See FIG. 31, Chiefly.):

The two-dimensional shape of the die pad 6 shown in FIG. 31 ischaracterized in that the semiconductor chip 2 is involved in the diepad 6 in plane view unlike the embodiments including that of FIG. 1. Thesimple-large-area die pad 6 has e.g. a substantially rectangular shape,and has no macro-scale opening therein. Therefore, the entire rear faceof the semiconductor chip 2, and an end lower face thereof are totallyprotected by the die pad 6. Further, the die-pad-support lead 7 can bemade shorter in comparison to the die-pad-support lead for thesmall-area die pad as shown in FIG. 1 and as such, the large-area diepad has the advantage that upward and downward shifts of the die pad 6caused by the clamp pressure become smaller.

Incidentally, the simple-large-area die pad may have a macro-scaleopening as in the modification as described below.

(3) Opened Large-Area Die Pad (See FIG. 32, Chiefly.):

The two-dimensional shape of the die pad 6 shown in FIG. 32 ischaracterized in that the semiconductor chip 2 is involved in the diepad 6 in plane view as in the case of FIG. 31. Further, thismodification has an additional feature such that the die pad has amacro-scale opening therein.

The opened large-area die pad according to this modification has thesame advantage as the simple-large-area die pad shown in FIG. 31 and inaddition, an advantage such that the adhesiveness to the sealing resinis improved as in case of the small-area die pad as shown in FIG. 1.

6. Description of a Modification in Connection of the Sealing Process inthe Method of Manufacturing a Semiconductor Device According to theEmbodiment Hereof (See FIG. 33, Chiefly.)

What is described here is a modification in connection with, of theassembly processes which have been described in the sections 1 to 4, thesealing process (the section 2). Basically the descriptions having beenpresented in the sections 1 to 5 hold true for this sectionsubstantially as they are. Therefore, only different points will bedescribed below as a rule.

FIG. 33 is a schematic sectional view (in the step of clamping the leadframe) for explaining a modification in connection with the sealingprocess in the method of manufacturing a semiconductor device accordingto the embodiment hereof, which corresponds to FIG. 12. The modificationin connection with the sealing process in the method of manufacturing asemiconductor device according to the embodiment hereof will bedescribed with reference to the drawing.

As shown in FIG. 33, no concaved part is formed on the side of the leadframe 1 unlike the state as shown in FIG. 12. Alternatively, a concavedpart (i.e. a clamp-face concaved part 58) is formed in a correspondingpart of the die (e.g. the upper die 51 a, namely the first molding die).

While the lead frame 1 without the concaved part is used in thismodification, the lead frame 1 with the concaved part formed therein maybe used as in the embodiment shown in FIG. 12. However, using the leadframe 1 without the concaved part rather than the lead frame with theconcaved part formed therein brings about the advantages of: being ableto reduce the manufacturing cost of the lead frame 1, being able tosecure the strength of the lead frame 1, and the like. Also, theclamp-face concaved part 58 may be formed in the lower die 51 b (i.e.the second molding die). Further, the clamp-face concaved part 58 may beformed in both of the clamp faces 53 a and 53 b of the upper and lowerdies 51 a and 51 b. Now, it is noted that the preferred size of theclamp-face concaved part 58 and the preferred position thereof are thesame as those of the concaved part 8 formed in the lead frame 1.

Further, using the lead frame 1 with no concaved part, and the diehaving the clamp-face concaved part 58 as shown in FIG. 33, for example,brings about the advantages of: being able to reduce the manufacturingcost of the lead frame 1, being able to secure the strength of the leadframe 1, and the like. However, using the lead frame 1 with the concavedpart formed therein, and the die without the clamp-face concaved part 58in combination as shown in FIG. 12, for example, is advantageous in thatit is possible to commonly use the die for more types of lead frames.

7. Further Description for the Embodiments (Including theModifications), and General Consideration Therefor (See FIG. 34,Chiefly.)

FIG. 34 is a schematic sectional view (in the resin sealing step) takenalong the line M-M′ of FIG. 11 for explaining the outline of the methodof manufacturing a semiconductor device according to the embodimenthereof. The further description in connection with the embodiment(including the modification) and the general consideration thereof willbe made with reference to the drawing.

(1) Outline of the Method of Manufacturing a Semiconductor DeviceAccording to the Embodiment Hereof (See FIG. 34, Chiefly.)

As described above, in the mold process of the lead frame article, theresin is supplied into the cavity with the tie-bar (dam bar) of the leadframe clamped by the dies (in the case of the transfer mold). The clamppart is arranged to have a width larger than that of the tie-bar so thatthe tie-bar can be reliably clamped by the clamp parts of the dies inthis step. Thus, the leads (i.e. the inner leads and the outer leads),and the hanging leads (i.e. the die-pad-support leads 7) are partiallyclamped by the dies. Then, with the hanging leads clamped by the dies,the hanging lead is deformed under the clamp pressure. In thissituation, if the clamp part of the upper die 51 a is larger, in width,than the clamp part of the lower die 51 b as shown in FIG. 34, forexample, the position of the die pad to which the hanging leads areconnected tends to shift downward (toward the direction to which the diepad is offset in FIG. 34). In case that the die pad shifts to below apredetermined position, the sealed body to be formed on the side of thelower face of the die pad which has been offset (i.e. down set in thiscase) ends up being formed to be thinner than a desired thickness. Ithas been found that as a result of this, in case that a stress isapplied to the sealed body formed on the side of the lower face of thedie pad, the stress can cause a package crack. The package crack isprone to occur in, of QFPs, a product having a smaller thickness in aresin formed on the side of the lower face of the die pad (e.g. LQFP orTQFP). Further, in the manufacture & inspection step, the package crackis often caused during the time of e.g. a temperature-cycle test (ofe.g. about 200 cycles of a combination of −55 degrees centigrade, and125 degrees centigrade. According to the study by the inventors hereof,it is expected that e.g. the delamination of the silver paste whichmakes an adhesive-member layer acts as a trigger, causing such packagecracks in packages arranged so that the sealed body is formed on theside of the lower face of the die pad to have a smaller thickness than adesired thickness (in the case of the small-area die pad).

As a countermeasure to this, in the resin seal process in the method ofmanufacturing a semiconductor device according to the embodiment hereof,the concaved part 8 is formed on the side of the first principal face (1a, 6 a) of the joint part 10 of the die-pad-support lead 7 of the leadframe 1, and the tie-bar 4, or the on the side of the second principalface (1 b, 6 b) as shown in FIG. 34. The arrangement like this preventsthe clamp pressure from being concentrated on a part of thedie-pad-support lead 7 located inside from and near the tie-bar 4,whereby the deformation of the die-pad-support lead 7 at that part isavoided. Therefore, the upward and downward shifts of the die pad 6owing to the deformation at this part are never caused.

(2) Consideration about Upward and Downward Movements of the Die PadOwing to the Deformation of the Die-Pad-Support Lead

Here, consideration will be made on the upward and downward movements ofthe die pad attributed to a clamp pressure by the dies caused in thecase of the lead frame having no concaved part as already described inconnection with the method of manufacturing a semiconductor deviceaccording to the embodiment hereof. This subsection is premised on e.g.a lead frame which is similar, in shape, to the lead frames shown in thedrawings to which reference was made so far (except FIG. 33), but has noconcaved part 8 as shown in FIG. 33.

The lead frame having a simple structure as shown in FIG. 30 (the I typedie-pad-support lead) will be described first. The quantity by which thelead frame is crushed by the clamp pressure is usually considered to beabout 10 micrometers in the case of the lead frame having a thickness ofabout 125 micrometers. Therefore, even if the die pad is forced to moveby the deformation (i.e. the reduction in the thickness of thedie-pad-support lead caused by the clamp pressure) or by e.g. thedie-pad-support lead being pushed down at the appropriate part, thequantity of the movement is about 10 micrometers at most, which accountsfor about 1/100 of one (1) millimeter serving as a rough standard of thepackage thickness, and cannot be a quantity posing a problem.

Now, assuming that the deformation changes the length of thedie-pad-support lead, and thus the die pad is forced to move downward orupward, quantitative consideration will be performed. First, a quantity“ΔL” of increase in the length “L” of the die-pad-support lead accordingto a quantity “ΔTf” of reduction in the thickness of the die-pad-supportlead caused by the clamp pressure is usually considered not to be asmuch as “ΔTf”, but to be smaller by an order. That is, it may beconsidered that “ΔL is as much as one (1) micrometer”. Incidentally, therelation among the length “L” of the die-pad-support lead, an increase“ΔL” thereof, and a quantity “ΔH” of downward or upward movement of thedie pad is approximately represented as follows: “ΔH≈(2L×ΔL)^(1/2)”.Assuming “L≈5 millimeters” for the sake of simplicity,“ΔH≈(2×5000×1)^(1/2)≈100 micrometers” can be obtained. Even incomparison to one (1) millimeter serving as a rough standard of thepackage thickness, the quantity of the movement can be sufficientlyregarded as possibly making some cause of a failure.

The reason why such very small increase in the length of thedie-pad-support lead is converted into a vertical movement of the largerdie pad is that the die-pad-support leads are suspended from itssurrounding parts, the die pad has no degree of freedom except that in avertical direction and in addition, and a degree of the contribution ofa vertical movement to the length near the height horizontally inparallel therewith, i.e. its initial height is relatively small. Inother words, an increase in the length of the die-pad-support lead issmall, and the length of the die-pad-support lead is a macro-scalequantity, and thus a quantity of vertical movement of the die pad can beregarded as being amplified into a semi-macro-scale quantity.

Next, the Y-type die-pad-support lead 7 as shown in FIG. 1 will beconsidered. First, it is assumed that the branch angle, i.e. an anglebetween the first branch 7 a and the second branch 7 b is 90 degrees. Inthis case, an increase “ΔL” of the length of the die-pad-support lead(in this case, an effective length, i.e. the length “L” in terms of theI-type die-pad-support lead) is reduced to about 70% because of thedifference between the important part (non-branch part) of thedie-pad-support lead 7 and each branch in direction. In the case of theY-type die-pad-support lead 7 (with a branch angle of 90 degrees), aquantity “ΔH” of downward or upward movement of the die pad is reducedto about 85% in comparison to that in the case of the I-typedie-pad-support lead.

Likewise, assuming a branch angle 120 degrees, an increase “ΔL” in thelength of the die-pad-support lead is reduced to about 50%. Therefore,in the case of the Y-type die-pad-support lead 7 (with a branch angle of120 degrees), a quantity “ΔH” of the downward or upward movement of thedie pad is reduced to about 70% in comparison to that in the case of theI-type die-pad-support lead.

Further, assuming a branch angle of 180 degrees, the increase “ΔL” inthe length of the die-pad-support lead becomes zero (0). Accordingly, inthe case of the Y-type die-pad-support lead 7 (with a branch angle of180 degrees), i.e. the T-type die-pad-support lead, the quantity “ΔH” ofdownward or upward movement of the die pad is theoretically becomes zero(0). However, in fact the same phenomenon is caused in the straight-linebranch (composed of the first and second branches 7 a and 7 b which forma straight line in combination), and thus the branch part 12 (i.e. acenter part of the straight-line branch) can be forced to shift upwardor downward. Since one half of the length of the straight-line branchcan be made shorter in comparison to the length of the die-pad-supportlead 7 sufficiently, the quantity is considered to be about 10micrometers at most. Therefore, the quantities of upward and downwardshifts of the die pad 6 according to such this are comparable to it,which is considered to be no problem.

In the case of the T-type die-pad-support lead, there is apprehensionthat some problem arises because of the instability of the straight-linebranch in the horizontal direction. In such case, the stability can beachieved by uniting the straight-line branch with the tie-bar 4 in thecorner parts.

The various examples for the presence or absence of the branch, and thebranch angle, which have been described above, are for explaining thelead frame without the concaved part 8. However, the differences of theeffects associated with various structures for thedie-pad-support-lead-outer-end portions hold true for the lead framehaving the concaved part 8 as they are.

Further, it is obvious that various examples concerning the lead framewithout the concaved part 8 which have been described in the subsectionalso constitute part of the embodiments (including the modifications)hereof. This holds true for other subsections.

(3) Consideration about the Direction of Movement

Next, the direction of vertical movement of the die pad will beconsidered. If the die pad and the die-pad-support lead are totally upand down symmetric in their cross section, for instance, the directionof movement is determined under the influence of the micro-scaleasymmetry (i.e. static micro-scale asymmetry) existing in the structureor the like. On the other hand, in cases such that macro-scaleasymmetries are involved owing to down-set processing, die bonding, andthe like, it is considered that the movement in a certain direction ismore likely to occur under the influence of those asymmetries. Incasessuch as the above-described embodiments, the die pad often shiftsdownward. If the die pad is moved downward, the sealed body formed onthe side of the lower face of the die pad will be formed to be thinnerthan a desired thickness, which can cause a package crack and the like.On the other hand, if the die pad is moved upward, a problem such thatbonding wire and the like are bared can be brought on.

On the other hand, in consideration of dynamic micro-scale asymmetry, towhich of the downward and upward directions the die pad is forced tomove can be determined depending on whether the inner-side part of thetie-bar is pushed down or up by the die or the like. Therefore, theeffect of avoiding the occurrence of a downward dynamic micro-scaleasymmetry is brought about by forming the concaved part in the upperface of the lead frame as shown in FIG. 3. This holds true for the caseof FIG. 33.

(4) Consideration about the Interrelation Between the Thickness of theUpper Resin-Sealed Body (on the Chip Front Face Side), and the Thicknessof the Lower Resin-Sealed Body (on the Chip Rear Face Side) in aPosition (Chip-&-Die-Pad Position) where a Semiconductor Chip and a DiePad are Placed:

In regard to the respective embodiments, a case such that the upperresin-sealed body is thicker, in thickness, than the lower resin-sealedbody mainly in the chip-&-die-pad position has been concretely describedas an example. However, it is obvious that the various embodiments(including the modifications) described above are applicable to both thecase where the thickness of the upper resin-sealed body is smaller thanthat of the lower resin-sealed body in the chip-&-die-pad position, andthe case where the thickness of the upper resin-sealed body iscomparable to that of the lower resin-sealed body in the chip-&-die-padposition. This is because the direction of movement of the die pad isnot necessarily the same for any cases, so a problem can equally occurfor both the case where the upper resin-sealed body is thinner, and thecase where the lower resin-sealed body is thinner. Further, even in thecase where the upper and lower resin thicknesses are comparable to eachother, it becomes an important problem to avoid a crack in the lowerface, the baring of a wire from the upper face side, and the like inconsideration with a package formed in a thin film.

8. Summary

The invention made by the inventor has been concretely described abovebased on the embodiments. The invention is not limited to theembodiments. It is obvious that various changes and modifications may bemade without departing from the subject matter hereof.

In regard to the embodiments above, for instance, a lead frame arrangedso that the die pad becomes smaller than the semiconductor chip in outersize has been taken as an example and described chiefly. However, theinvention hereof is not limited to the embodiments. It is obvious thatthe invention is also applicable to a lead frame arranged so that thedie pad becomes larger than the semiconductor chip in outer size.

While for the embodiments described above, the example that the gatepart is formed on both of the lower and upper dies has been describedchiefly, the invention hereof is not limited to the embodiments.

It is obvious that the invention is applicable to a case where the gatepart is formed on only one of the lower die and the upper die.

Further, while in the embodiments, the lead frame subjected to thedown-set processing has been taken as an example chiefly and concretelydescribed, the invention hereof is not limited to the embodiments. It isobvious that the invention is applicable to a case where a lead framewhich has not experienced the down-set processing is used.

What is claimed is:
 1. A semiconductor device, comprising: a die pad; adie-pad-support lead supporting said die pad, said die-pad-support leadhaving: an end face, and a step reaching to said end face; asemiconductor chip mounted over said die pad, said semiconductor chiphaving a plurality of bonding pads; a plurality of leads electricallyconnected with said bonding pads via a plurality of wires, respectively;and a resin-sealing-body sealing said semiconductor chip, said wires anda part of each of said leads, wherein said end face of saiddie-pad-support lead is exposed from said resin-sealing-body, whereinsaid resin-sealing-body is comprised of: a first resin-sealing-bodyhaving: an upper surface of said resin-sealing-body, and a first sidesurface intersecting with said upper surface of said resin-sealing-body,and a second resin-sealing-body having: a lower surface of saidresin-sealing-body, and a second side surface intersecting with saidlower surface of said resin-sealing-body, and wherein said first sidesurface of said first resin-sealing-body is located closer than saidsecond side surface of said second resin-sealing-body to saidsemiconductor chip.
 2. The semiconductor device according to claim 1,wherein said step is comprised of: a first surface intersecting withsaid end face, and a second surface intersecting with said firstsurface; and wherein said first surface and said second surface arecovered with said resin-sealing-body.
 3. The semiconductor deviceaccording to claim 1, wherein an external size of said die pad issmaller than an external size of said semiconductor chip.
 4. Thesemiconductor device according to claim 3, wherein saidresin-sealing-body has: said upper surface located above saidsemiconductor chip, and said lower surface opposite to said uppersurface; wherein said die-pad-support lead has: an upper surface facingtoward said upper surface of said resin-sealing-body, and a lowersurface facing toward said lower surface of said resin-sealing-body;wherein said die-pad-support lead is bent from said end face toward saidlower surface of said resin-sealing-body; wherein said die pad islocated closer than said upper surface of said resin-sealing-body tosaid lower surface of said resin-sealing-body; and wherein said step iscomprised of: a first surface intersecting with said end face, and asecond surface intersecting with said first surface and alsointersecting with said upper surface of said die-pad-support lead. 5.The semiconductor device according to claim 1, wherein saidresin-sealing-body has: said upper surface located above saidsemiconductor chip, and said lower surface opposite to said uppersurface; wherein said die-pad-support lead has: an upper surface facingtoward said upper surface of said resin-sealing-body, and a lowersurface facing toward said lower surface of said resin-sealing-body;wherein said die-pad-support lead is bent from said end face toward saidlower surface of said resin-sealing-body; wherein said die pad islocated closer than said upper surface of said resin-sealing-body tosaid lower surface of said resin-sealing-body; and wherein said step iscomprised of: a first surface intersecting with said end face, and asecond surface intersecting with said first surface and intersectingwith said upper surface of said die-pad-support lead.
 6. A semiconductordevice, comprising: a die pad; a die-pad-support lead supporting saiddie pad, said die-pad-support lead including; a first portion having: anend face, and a step reaching to said end face, a second portion betweensaid first portion and said die pad, and a third portion between saidfirst portion and said second portion, a semiconductor chip mounted oversaid die pad, said semiconductor chip having a plurality of bondingpads; a plurality of leads electrically connected with said bonding padsvia a plurality of wires, respectively; and a resin-sealing-body sealingsaid semiconductor chip, said wires, and a part of each of said leads,wherein each of said first portion and said second portion extends alonga first direction, wherein said third portion extends along a seconddirection, wherein said end face of said die-pad-support lead is exposedfrom said resin-sealing-body, wherein said resin-sealing-body iscomprised of: a first resin-sealing-body having: an upper surface ofsaid resin-sealing-body, and a first side surface intersecting with saidupper surface of said resin-sealing-body, and a secondresin-sealing-body having: a lower surface of said resin-sealing-body,and a second side surface intersecting with said lower surface of saidresin-sealing-body, and wherein said first side surface of said firstresin-sealing-body is located closer than said second side surface ofsaid second resin-sealing-body to said semiconductor chip.
 7. Thesemiconductor device according to claim 6, wherein said step iscomprised of: a first surface intersecting with said end face, and asecond surface intersecting with said first surface, and wherein saidfirst surface and said second surface are covered with saidresin-sealing-body.
 8. The semiconductor device according to claim 6,wherein an external size of said die pad is smaller than an externalsize of said semiconductor chip.
 9. The semiconductor device accordingto claim 8, wherein said resin-sealing-body has an upper surface locatedabove said semiconductor chip, and a lower surface opposite to saidupper surface, wherein said die-pad-support lead has; an upper surfacefacing toward said upper surface of said resin-sealing-body, and a lowersurface facing toward said lower surface of said resin-sealing-body,wherein said die-pad-support lead is bent in said second directiontoward said lower surface of said resin-sealing-body, wherein said diepad is located closer than said upper surface of said resin-sealing-bodyto said lower surface of said resin-sealing-body, and wherein said stepis comprised of: a first surface intersecting with said end face, and asecond surface intersecting with said first surface and alsointersecting with said upper surface of said die-pad-support lead. 10.The semiconductor device according to claim 6, wherein saidresin-sealing-body has: an upper surface located above saidsemiconductor chip, and a lower surface opposite to said upper surface,wherein said die-pad-support lead has: an upper surface facing towardsaid upper surface of said resin-sealing-body, and a lower surfacefacing toward said lower surface of said resin-sealing-body, whereinsaid die-pad-support lead is bent in said second direction toward saidlower surface of said resin-sealing-body, wherein said die pad islocated closer than said upper surface of said resin-sealing-body tosaid lower surface of said resin-sealing-body, and wherein said step iscomprised of: a first surface intersecting with said end face, and asecond surface intersecting with said first surface and intersectingwith said upper surface of said die-pad-support lead.